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2018 Programme

The programme for the China International Semiconductor Executive Summit has gone through thorough revision to ensure it meets the needs of the international semiconductor industry through analysis of our high level advisory board.

If you have any questions or contributions towards the programme, please contact us

Day 1 – Advanced Packaging 先进的封装技术

Theme:

What Is the Role of Advanced Packaging in Die Disintegration & Heterogenous Integration?

Panel Discussions:

Topic – Trade War

Vendor vs Customer

         

    Day 2 – Fab/Front End Manufacturing晶圆厂/前段制造 

Theme:

* Front End Manufacturing Panel Discussion: MEMORY

* Local Chinese Semi vs International Semi

* High Bandwidth Memory: How Fast Are They Going to Be?

* Roadmap for Next 5 Years

* HBM in Artificial Intelligence

 

Day 3 – Fabless 无晶圆厂

IC Design/End User Focus Day:

* Challenge in Semiconductor in Autonomous Driving

Theme for China Foundries:

What is the Ramping Update / Technology Transfers Going On

Day 1
18 Sep 2018
Day 2
19 Sep 2018
Day 3
20 Sep 2018

Registration

08:00 – 08:45

Opening Ceremony

08:45 - 09:00
Dr Babak Sabi, Intel Corporation

Keynote Speaker: Dr Babak Sabi, Corporate VP & Director of Assembly & Test Technology Development – Intel | Topic: Advanced Packaging, Heterogenous Integration and Big Data

09:00 – 09:20
Dr Babak Sabi, Intel Corporation
Mr David Fang, Powertech Technology Inc. (PTI)

Mr David Fang, CTO – Powertech Technology Inc. (PTI) | Topic: Packaging Technology for Heterogeneous Integration

09:20 – 09:40
Mr David Fang, Powertech Technology Inc. (PTI)
Mr JUERGEN WOLF, FRAUNHOFER IZM-ASSID DRESDEN-GERMANY

Mr Juergen Wolf, VP Advanced Packaging – Fraunhofer | Topic: Heterogenous Wafer Level System Integration

09:40 - 10:00
Mr JUERGEN WOLF, FRAUNHOFER IZM-ASSID DRESDEN-GERMANY
Mr SANTOSH KUMAR, Yole Development

Mr SANTOSH KUMAR, Director & Principal Analyst – Yole Development | Topic: Advanced Packaging as Enabler of Future Semiconductor Devices Innovation

10:00 – 10:20
Mr SANTOSH KUMAR, Yole Development

Business Meetings / Networking / Coffee and Tea Breaks

10:20 – 11:20
Mr Jaroslav Klima, Tescan Orsay Holding

Mr Jaroslav Klima, CEO – Tescan Orsay | Topic: Failure Analysis in the Semiconductor Industry (Getting Workflows Gradually Completed)

11:20 – 11:50
Mr Jaroslav Klima, Tescan Orsay Holding
Dr Yu-Po Wang 王愉博 先生, SPIL

Dr Yu-Po Wang 王愉博 先生, Senior Director – Siliconware Precision Industries Co Ltd (SPIL) | Topic: System Integration

11:50 – 12:10
Dr Yu-Po Wang 王愉博 先生, SPIL
Dr Marvin Liao, TSMC

Dr Marvin Liao, Senior Director Backend Operations – TSMC | Topic: Heterogeneous Advanced Packaging for HPC/Mobile Systems

12:10 – 12:30
Dr Marvin Liao, TSMC
Mr Daniel Rickenbacher, BESI Switzerland AG

Mr Daniel Rickenbacher, VP R&D – BESI | Topic: An update of advanced packaging technology at BESI

12:30 – 13:00
Mr Daniel Rickenbacher, BESI Switzerland AG

Lunch

13:00 – 14:00
MR CHOON-KHOON LIM, ASMPT

Mr Choon-Khoon Lim, BU Deputy CEO – ASMPT | Topic: ASMPT – Connecting The Data Centric World

14:00 – 14:30
MR CHOON-KHOON LIM, ASMPT
Mr Daping Yao Ph.D., National Center For Advanced Packaging Co., ltd. (NCAP China)

Mr Daping Yao, Ph.D, Technical Director – National Center For Advanced Packaging Co., ltd. (NCAP China) | Topic: Development of Fan-Out Packaging Technology in NCAP China

14:30 – 14:50
Mr Daping Yao Ph.D., National Center For Advanced Packaging Co., ltd. (NCAP China)
Mr Allen Chang, Macquarie Group

Mr Allen Chang, Head of Greater China Technology & Telecom Research/Managing Director – Macquarie Group

14:50 – 15:20
Mr Allen Chang, Macquarie Group
Mr Yiran Liao, Alibaba Cloud

Mr Yiran Liao, Technical Expert IoT BU – Alibaba Cloud | Topic: AliOS Things Drivers the IoT World (Presented in Chinese)

15:20 – 15:40
Mr Yiran Liao, Alibaba Cloud

Business Meetings / Networking / Coffee and Tea Breaks

15:40 – 16:40
Mr Lung Chu, SEMI China

Mr Lung Chu, President – SEMI China | Topic: Topic: China’s Role in the Evolving Global IC Industry

16:40 – 17:00
Mr Lung Chu, SEMI China
Mr Hubert Changchien, ASE

Mr Hubert Changchien, Director Customer Engineering Integration, Central Engineering – ASE | Topic: Next Generation of Advanced Packaging Solution

17:00 – 17:20
Mr Hubert Changchien, ASE
Mr Lam-Wai Yong, Carsem Semiconductor

MR LW Yong, CTO – Carsem Semiconductor | Topic: An OSAT Automotive Journey

17:20 – 17:40
Mr Lam-Wai Yong, Carsem Semiconductor
Dr Suresh Venkatesan, POET Technologies

Mr Suresh Venkatesan, CEO – POET Technologies | Topic: Chip Scale Assembly for Photonic Optical Engines Using the POET OpticalInterposerTM

17:40 – 18:10
Dr Suresh Venkatesan, POET Technologies

Panel Session

18:10 – 19:00

Gala Dinner – CISES Awards

19:00 – 21:00

Boat Cruise

21:00 – Late

Registration

08:45 – 09:30
Dr Thomas Morgenstern, Global Foundries

Dr Thomas Morgenstern, SVP & GM of Fab 1 – Global Foundries | Topic: Driving Differentiated Solutions with FD-SOI for Demanding Markets

09:30 – 10:00
Dr Thomas Morgenstern, Global Foundries
Dr David Lishan, Plasma-Therm LLC

Dr David Lishan, Principal Scientist & Director Technical Marketing – Plasma-Therm | Topic: Low Temperature, Low Damage Plasma Technologies for Advanced Packaging Applications

10:00 - 10:30
Dr David Lishan, Plasma-Therm LLC
Mr Andy Chuang, Episil technologies Inc.

Mr Andy Chuang, President – Episil Technologies Inc | Topic: SiC Foundry Introduction from Episil

10:30 – 11:00
Mr Andy Chuang, Episil technologies Inc.

Business Meetings / Networking Session / Coffee and Tea Break

11:00 – 12:00
Mr Günther Ernst, LFoundry

Mr Günther Ernst, CEO – LFoundry | Topic: How Semiconductor Foundries “CAN DRIVE THE FUTURE” in the new Microelectronics Megatrends

12:00 – 12:30
Mr Günther Ernst, LFoundry
Mr Kai-Fai Ng, SEMI Southeast Asia

Mr Kai-Fai Ng, President – SEMI Southeast Asia | Topic: Southeast Asia’s Collaborative Role in the Growth of Global Electronics Manufacturing Ecosystem

12:30 – 13:00
Mr Kai-Fai Ng, SEMI Southeast Asia

Lunch

13:00 – 14:00
Dr Pengju Kang, XD Group Corporation

Dr Pengju Kang, GM of Corporate Research – XD Group Corporation | Topic: Designing Power Semiconductor Systems Industrial Internet Ready and Future Proof

14:00 – 14:30
Dr Pengju Kang, XD Group Corporation
Mr Cao Hong, Infineon

Author: Mr Olaf Herzog, VP Corporate Supply Chain & Factory Integration / Presenter: Mr Cao Hong, IT Head for China – Infineon | Topic: Industry 4.0 at Infineon Wuxi – Next Steps

14:30 – 15:00
Mr Cao Hong, Infineon
Dr Min-hwa Chi, SiEnna (QingDao) Integrated Circuits, Co.

Dr Min-hwa Chi, SVP/TD – SiEnna (QingDao) Integrated Circuits, Co. | TOPIC: Overview of Foundry Trend and new business model C-IDM

15:00 – 15:30
Dr Min-hwa Chi, SiEnna (QingDao) Integrated Circuits, Co.

Business Meetings / Networking Session / Coffee and Tea Break

15:30 – 16:30
Mr SUNIL BANWARI

Mr Sunil Banwari | Topic: Industry 4.0 Application to Semiconductor Test

16:30 – 17:00
Mr SUNIL BANWARI

Panel Session – Moderated by Mr Farhat Jahangir, SVP Manufacturing & Quality – Quantenna

17:00 – 17:45

Dinner

17:45 – 20:00

Entertainment

20:00 - Late

Registration

08:45 – 09:30
Mr Claudio Piemonte, Broadcom Inc.

Mr Claudio Piemonte, Head of Radiation Sensors R&D – Broadcom Inc | Topic: Single-photon sensor technologies for automotive Lidar

09:30 – 10:00
Mr Claudio Piemonte, Broadcom Inc.
MR DAVID GREENLAW, NVIDIA

Mr David Greenlaw, VP Product Engineering – Nvidia | Topic: Kuhn’s ‘Essential Tension’ and How to do Debug

10:00 – 10:30
MR DAVID GREENLAW, NVIDIA

Business Meetings / Networking Session / Coffee and Tea Breaks

10:30 – 11:30
Mr Gopi Sirineni, Qualcomm

Mr Gopi Sirineni, VP Product Management – Qualcomm | Topic:Advanced Mesh Systems Transforming the Wireless Landscape

11:30 – 12:00
Mr Gopi Sirineni, Qualcomm
Mr Brad Hoskins, Cypress Semiconductor

Mr Brad Hoskins, VP MCU Design Engineering – Cypress Semiconductor | Topic: Scalable design for the IoT

12:00 – 12:30
Mr Brad Hoskins, Cypress Semiconductor
MR Bill Lu, Zbit Semiconductor Inc.

MR BILL LU, CEO – ZBIT SEMICONDUCTOR INC. | Topic: A NOR Flash Based Convolution Computation for On-device AI Inference Applications

12:30 – 13:00
MR Bill Lu, Zbit Semiconductor Inc.

Lunch

13:00 – 14:00
Mr CY Chen, Integrated Device Technology (IDT)

Author: Dr Sailesh Chittipeddi, EVP Global Operation & CTO / Presenter: Mr CY Chen, VP Technology & Operation – IDT | Topic: Sensor

14:00 – 14:30
Mr CY Chen, Integrated Device Technology (IDT)
Dr Jimmy Hsiao, Skymizer

Dr Jimmy Hsiao, Director – Skymizer | Topic: Opening the pathway for Semiconductor Industry to Enter AI Era

14:30 – 15:00
Dr Jimmy Hsiao, Skymizer
Dr Daquan Yu – Huatian

Dr Daquan Yu, CTO – Huatian | Topic: Advanced Packaging Platform Based on TSV and Fan-Out Technology

15:00 – 15:30
Dr Daquan Yu – Huatian

Business Meetings / Networking Session / Coffee and Tea Break

15:30 – 16:30
Dr Ronsisvalle Cesare, Bruckewell Technology Europe GmbH

Dr Cesare Ronsisvalle, Associate Founder & CTO – Bruckewell Technology GmbH | Topic: Technology Of The Modern Power Semiconductor Devices

16:30 – 17:00
Dr Ronsisvalle Cesare, Bruckewell Technology Europe GmbH
Mr Farhat Jahangir, Quantenna

MR FARHAT JAHANGIR, SVP MANUFACTURING & QUALITY – QUANTENNA | TOPIC: CONNECTIVITY & IT’S FUTURE

17:00 – 17:30
Mr Farhat Jahangir, Quantenna
Mr Andrew Peng, Spin Transfer Technologies

Mr Andrew Peng, VP Business Development Greater China – Spin Transfer Technologies | Topic: MRAM is ready for applications

17:30 – 18:00
Mr Andrew Peng, Spin Transfer Technologies
Mr David Zhang, Pudong Tv Station

Mr David Zhang, Automotive Consultant – Pudong Tv Station | Topic: The state-of-art of New Technology on Connected Car

18:00 – 18:30
Mr David Zhang, Pudong Tv Station

Closing Dinner

18:30 – 20:30