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2018 Programme

The programme for the China International Semiconductor Executive Summit has gone through thorough revision to ensure it meets the needs of the international semiconductor industry through analysis of our high level advisory board.

If you have any questions or contributions towards the programme, please contact us

Day 1 – Advanced Packaging 先进的封装技术

Theme:

What Is the Role of Advanced Packaging in Die Disintegration & Heterogenous Integration?

Panel Discussions:

Topic – Trade War

Vendor vs Customer

         

    Day 2 – Fab/Front End Manufacturing晶圆厂/前段制造 

Theme:

* Front End Manufacturing Panel Discussion: MEMORY

* Local Chinese Semi vs International Semi

* High Bandwidth Memory: How Fast Are They Going to Be?

* Roadmap for Next 5 Years

* HBM in Artificial Intelligence

 

Day 3 – Fabless 无晶圆厂

IC Design/End User Focus Day:

* Challenge in Semiconductor in Autonomous Driving

Theme for China Foundries:

What is the Ramping Update / Technology Transfers Going On

Day 1
18 Sep 2018
Day 2
19 Sep 2018
Day 3
20 Sep 2018

Registration

Opening Ceremony

Lunch

Panel Session

Boat Cruise

Registration

Lunch

Dinner

Entertainment

Registration

Lunch

Closing Dinner