The programme for the China International Semiconductor Executive Summit has gone through thorough revision to ensure it meets the needs of the international semiconductor industry through analysis of our high level advisory board.
Day 1 – Advanced Packaging 先进的封装技术
What Is the Role of Advanced Packaging in Die Disintegration & Heterogenous Integration?
Topic – Trade War
Vendor vs Customer
Day 2 – Fab/Front End Manufacturing晶圆厂/前段制造
* Front End Manufacturing Panel Discussion: MEMORY
* Local Chinese Semi vs International Semi
* High Bandwidth Memory: How Fast Are They Going to Be?
* Roadmap for Next 5 Years
* HBM in Artificial Intelligence
Day 3 – Fabless 无晶圆厂
IC Design/End User Focus Day:
* Challenge in Semiconductor in Autonomous Driving
Theme for China Foundries:
What is the Ramping Update / Technology Transfers Going On