Call: +852 8192 6020 |

Keynote Speaker: Dr Babak Sabi, Corporate VP & Director of Assembly & Test Technology Development – Intel | Topic: Advanced Packaging, Heterogenous Integration and Big Data

18 Sep 2018
09:00 – 09:20

Keynote Speaker: Dr Babak Sabi, Corporate VP & Director of Assembly & Test Technology Development – Intel | Topic: Advanced Packaging, Heterogenous Integration and Big Data

The world around us is becoming more and more dependent on data. As Clive Humby, Uk Mathematician, put it “date is the new oil; if unrefined it cannot really be used”. Processing big data efficiently is heavily dependent on advances in system computing and communications. This presentation will talk about the requirements for advanced system performance including high bandwidth and low power data pipes; and the methods by which ultra-high performance for next generation devices can be achieved trough heterogeneous integration on advanced packages. A multitude of multi-chip packaging including 2D, 2.5D, and 3D will be reviewed; and finally the direction for heterogeneous packaging in the future and its challenges will be discussed.