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China International Semiconductor Executive Summit

5-6 September 2019 / Shanghai, China

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IC Design / AI / 5G companies:

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software suppliers:

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The World's Leading Semiconductor Manufacturing Gathering

China International Semiconductor Executive Summit is the world’s foremost annual meeting and business platform for engaging with political, business, financial, research and industry leaders of the semiconductor manufacturing industry.

Exclusive C-Level Participation


Pre-arranged 1-to-1 Meetings


Elite Conference Platform


A Hub for Global Networking

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Who Are We?

We’re committed to advancing future semiconductor manufacturing by driving innovation, business and investment opportunities.

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Why Attend?

We attract senior government officials, research institutes, investors and their industry counterparts from around the world.

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Why Sponsor?

We carefully profile all delegates pre-registration to ensure an audience of exclusive members looking for new solution providers.

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2019 Speakers

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2019 Programme

Day 1
05 Sep 2019
Day 2
06 Sep 2019
Guoliang Cao, Mayor

Opening Address, GuoLiang Cao -Haining Municipal Goverment

08:30 – 08:50
Guoliang Cao, Mayor
Babak Sabi, Intel Corporation

Keynote Address| Babak Sabi, Corp VP & Director of Assembly & Test Technology Development – Intel Topic: Advanced Packaging, Heterogeneous Integration, and Big Data

08:50 – 09:10
Babak Sabi, Intel Corporation
Marvin Liao, TSMC

Marvin Liao, VP Backend Semiconductor Operations – TSMC | Topic: Advanced Packaging Solution for High Performance Computing

09:10 – 09:30
Marvin Liao, TSMC
Jong-Heon Kim, NEPES Corporation

Jong Heon Kim, SVP Technology & Operations Semiconductor BU – NEPES Corporation | Topic: Ultimate 3D Package Solution by FO / PLP Technology

10:10 – 10:30
Jong-Heon Kim, NEPES Corporation
Curtis Zwenger, Amkor Technology

Curtis Zwenger, VP Adv. Packaging & Technology Integration – Amkor | Topic: Advanced Packaging: The Rise of Heterogeneous Integration

11:30 – 11:50
Curtis Zwenger, Amkor Technology
Julio Coppo, Nanotronics

Julio Coppo, VP of Sales and Strategic Business Development |Topic: Reinforcement Factories

17:10 – 17:30
Julio Coppo, Nanotronics
Guoliang Cao, Mayor

Opening Panel Discussion

09:00 – 09:30
Guoliang Cao, Mayor
Steven Craig, Western Digital

Steven Craig, SVP & GM of China Operations – Western Digital | Topic: Data-centric Architecture for the Zettabyte Age – Opportunities, Challenges and Tiers

09:30 – 09:50
Steven Craig, Western Digital
Mustafa Pinarbasi, Spin Memory

Mustafa Pinarbasi, CTO, SVP Magnetics Technology – SPIN Memory |Topic: “The MRAM Revolution”

09:50 – 10:10
Mustafa Pinarbasi, Spin Memory
Jennifer Zhao, ams AG

Jennifer Zhao, EVP and GM for Advanced Optical Sensors – ams AG | Topic: ams Sensor Innovation in a Changing Global Smartphone Market

11:30 – 11:50
Jennifer Zhao, ams AG
Lilly Chung, Deloitte

Lilly Chung, Partner – Deloitte | Topic: TMT Outlook: A Rapidly Changing Landscape Keeps Decision Makers Alert

13:20 – 13:40
Lilly Chung, Deloitte
M. Juergen Wolf, Fraunhofer IZM-ASSID

M. Juergen Wolf, VP Advanced Packaging – Fraunhofer IZM ASSID | Topic: Heterogeneous Integration – Requirements and Enabling Technologies

17:30 – 17:50
M. Juergen Wolf, Fraunhofer IZM-ASSID

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Venue

Fairmont Peace Hotel
20 Nanjing E Rd, Wai Tan, Huangpu Qu, Shanghai Shi, China, 200002
+86 21 6321 6888

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