This registration section is for equipment / materials / software providers.
To register to become a supplier/sponsor for our event, please complete and submit the registration form below:
Your Name (required)
Your Email (required)
Company Name (required)
Company Designation / Job Title (required)
Company Department (required)
Company Website (required)
Company Full Address (required)
EVP and GM for Advanced Optical Sensors Division, AMS AG
Jennifer Zhao joined ams AG as EVP and GM for Advanced Optical Sensors Division in 2017. She served as SVP, Global Sales and Marketing at Nexperia and held multiple management positions at NXP Semiconductors and Tyco International before that. Jennifer has managed various businesses including System Management, Logic and Microcontrollers and worked with leading OEM’s worldwide in Mobile and Consumer, Automotive and Industrial segments. Currently, Jennifer manages a global team with R&D, Operations, Marketing and Application resources in the US, Europe, Greater China, and South East Asia.
CTO & VP, Powertech Technology Inc.
1. Setup and led PTI package R&D center to develop 32 chips stacking, fine pitch FC, WL, Panel Fan out, and 3DIC TSV package.
2. Held multiple managerial positions in semiconductor companies of IC design, process, and packaging
3. Has been filed and granted 60 patents worldwide.
Senior Director, SPIL
Wang Yu-Po received Ph.D. in Mechanical Engineering from State University of New York at Binghamton, U.S.A
In 1997, he started career at Gintic Institute of Manufacturing Technology in Singapore. He has jointed SPIL since 1998 and led the R&D advanced packaging design team for leadframe, substrate and wafer form packages development.
Dr. Wang has strong knowledge and experience in packaging characterization including thermal/ electrical simulation, advanced material(co-development), design and advanced packaging development. He has 83 patents in US.
CTO, Huatian Group
Dr. Daquan Yu is a Distinguished Professor of Xiamen University and the CEO of Xiamen Sky Semiconductor Co., Ltd. He was the President of Research Academy of Advanced Packaging Technology of TSHT Group from 2014 to 2019. He was a professor of Institute of Microelectronics, Chinese Academy of Sciences from 2010 to 2015. He had carried out research work at Fraunhofer IZM in Germany, and Institute of Microelectronics in Singapore from 2005 to 2010. He has authored or co-authored more than 160 peer-reviewed technical publications. He holds more than 40 patents. He is an IEEE senior member since 2013.
Corporate VP, GM Assembly & Test Technology Development, Intel Corporation
Babak Sabi is the Corporate Vice President and General Manager of Assembly and Test Technology Development. Since 2009, he has been responsible for the company’s packaging assembly process, packaging materials, enabling assembly and test technology development. Sabi joined Intel in 1984.
Prior to leading ATTD, Sabi led the Corporate Quality Network within Intel’s Technology Manufacturing Group from 2002 to 2009. He led a company-wide network of quality and reliability organizations responsible for product reliability customer satisfaction and quality business practices.
Previously, Sabi managed technology development quality and reliability and was responsible for silicon technology certification, assembly, test, and board processes.
Sabi received his Ph.D.in solid-state electronics from Ohio State University in 1984. He has written 10 papers on reliability physics and has received 5 Intel Achievement Awards. He currently holds 2 patents.
EVP Head of Substrate Solution Business Unit, Samsung
Graduated from Stevens Institute of Technology with a Ph.D. in Material Science & Engineering
VP Advanced Packaging, Fraunhofer IZM-ASSID
M. Juergen Wolf received a M.S. degree in Electrical Engineering from the Technical University Chemnitz. After gaining fundamental experience in the industry for several years, he joined the faculty Microperipheric Technologies at the Technical University Berlin. Here, he was mainly involved in the development of wafer level packaging processes, the development of flip chip multi-chip modules, RF modules and high density pixel detector modules. In 1994 M. Juergen Wolf changed to Fraunhofer Institute for Reliability and Microintegration IZM Berlin and worked as a group & project manager in the department HDI&WLP in the field of wafer level packaging and system in package (SiP). He was especially responsible for the development, coordination and implementation of new technologies for wafer level packaging and system integration. From 2000 until 2010 he additionally took over the position of personal assistant for the director of Fraunhofer IZM – Prof. Dr.-Ing. Dr.-Ing. E.h. Herbert Reichl. Starting in 2009, he was coordinating and planning and realization of the new center – All Silicon System Integration Dresden – ASSID of Fraunhofer IZM. Under his leadership a full industrial compatible process line for Wafer level Packaging and 3D integration was established. Since 2011, he is head of the department “Wafer Level System Integration” and also continued managing the center ASSID featuring a 200/300 mm 3D wafer level integration line. M.J. Wolf is actively involved in a number of research projects on national, European and international level. M. Juergen Wolf is a member of IEEE and SMTA and among others, a longstanding member and European representative in different technical international packaging groups e.g. formally TWG of Assembly & Packaging of the International Roadmap of Semiconductors (ITRS) and now the Heterogeneous Integration Roadmap (HIR) and the Jisso International Council (JIC) where he is actively contributing to the strategy and packaging roadmap development. Since 2016 Wolf is a member of the advisory board of 3D Incites (https://www.3dincites.com/about-us/advisory-board/). Wolf is one of the initiators and co-chair of the Fraunhofer Cluster 3D Integration which was established in 2013 and comprises 5 Fraunhofer institutes. He has also initiated the annual 3D European Summit Conference where he is a member of the steering committee. He has authored and co-authored numerous scientific papers presentations and reports in the field of microelectronic packaging and holds a number of patents.
Technical Director, NCAP
Dr. Yao joined NCAP China as a technical director in June 2017. He has been responsible for extending technical capability in FOWLP and establishing volume production lines dedicated to FOWLP. Jiangsu CAS Microelectronics Integration Technology Co Ltd, CASMEIT, was founded in Xuzhou city, Jiangsu province in March 2018, where Dr. Yao currently serves as CEO. Prior to this role, Dr. Yao serves as a senior member of technical staff and metal CVD core team leader in Applied Materials Inc., Santa Clara, California, USA. He had worked for the company for over 21 years in various roles, including the development of various IC manufacturing processes and equipment.
Lilly is a seasoned digital innovation executive with over 30 years of experience advising both Fortune 500 and emerging technology companies doing business globally. Lilly’s career reflects a demonstrated track record in driving innovation, leading successful large-scale digital transformation initiatives in complex, global business environment, and executing strategic alliances in the technology ecosystem. She brings deep expertise in strategy and execution of major M&A deals and post-merger integration synergy capture as well as the deployment of cloud, industrial IoT, and Industry 4.0 solutions. Lilly brings a broad set of industry experiences, including semiconductor, automotive, ecommerce, and manufacturing in both the US and China.
Lilly is responsible for the relationships and client engagements for some of Deloitte’s largest global clients and works cross-border in China, Japan, Brazil, India, and EU countries. Lilly led a team to help a $170B manufacturing company to develop its acquisition strategy, execute the transaction, and obtain post-merger synergy in a successful M&A deal valued near $900M. Lilly has been working closely with digital platform companies to develop technology-enabled transformation solutions for enterprises in new retail, automotive, FinTech and smart cities.
Lilly has led numerous strategic initiatives for Deloitte and is recognized for her commitment to nurturing and promoting women leadership and inclusion in technology companies. She is an advisor for the Women in Engineering initiative sponsored by major universities in Silicon Valley and has led Deloitte’s Chinese Service Group, Women’s Initiative (WIN), Client Leader Development program and is nationally recognized as a firm expert for the semiconductor industry. She also served on the nominating committee for Deloitte’s Board of Directors.
Lilly started her career in the semiconductor industry, where she spent 10 years as a design engineer, including the first 32-bit microprocessor. She held increasing responsibility to include strategic planning and technology transfer at Xerox Palo Alto Research Center. Lilly was one of the founders of Pictron, which provides video search software for Fortune 500 companies. Lilly was responsible for all aspects of the business including fundraising, strategic partnership, business development. Lilly also interned at the venture capital firm: TA Associates in Boston to identify investment opportunities.
Lilly is the co-chair of China Committee of Bay Area Council in California, and she served as the global chair of MJ Science and Technology Association as well as on the advisory board of UC Berkeley Extension Program. Lilly is a frequent speaker at industry events, including the Hamburg Summit, Wharton Business School, University of Berkeley, Stanford University, as well as Chinese TV news. Lilly was also selected as one of the most influential women by the San Francisco Business Times. Lilly is fluent in Mandarin Chinese.
Lilly received her bachelor and master degrees in Electrical Engineering from the University of Southern California. She received her master degree in Engineering Management & Industrial Engineering from Stanford University and an M.B.A. from Harvard Business School.
SVP, Manufacturing & Quality, Quantenna
Farhat Jahangir joined Quantenna in 2013 and is Senior Vice President of Manufacturing & Quality. He brings over 20 years of success in global manufacturing operations, product engineering, quality and reliability functions of semiconductor and system products. Prior to joining Quantenna, Mr. Jahangir served as head of Operations and Quality at Synerchip / MultiMedia Crossing (IP later acquired by Silicon Image Inc.) where he oversaw high-speed, mixed-signal IC and system products from concept to end-of-life. Previously, he was the director of Operations at SiTime Corporation (a MEMS-based timing solution startup), where he was a pivotal contributor in building the company’s negative margin product line to positive – enabling market penetration and sales growth. Mr. Jahangir has held various engineering and management positions in the areas of semiconductor operations and manufacturing at such companies as Silicon Image, Texas Instruments Inc., and Cypress Semiconductor Corporation. He also has experience in global manufacturing operations, supplier management, new product development, and the assurance of quality and reliability processes. Mr. Jahangir holds a Master of Science degree in Electrical Engineering from the University of Arkansas at Fayetteville.
President & Founder, Techsearch International Inc.
E. Jan Vardaman is president and founder of TechSearch International, Inc., which has provided market research and technology trend analysis in semiconductor packaging since 1987. She is the co-author of How to Make IC Packages (by Nikkan Kogyo Shinbunsha), a columnist with Printed Circuit Design & Fab/Circuits Assembly, and the author of numerous publications on emerging trends in semiconductor packaging and assembly. She is a senior member of IEEE EPS and is an IEEE EPS Distinguished Lecturer. She is a member of SEMI, SMTA, IMAPS, and MEPTEC. She received the IMAPS GBC Partnership award in 2012 and the Daniel C. Hughes, Jr. Memorial Award in 2018. She is an IMAPS Fellow. Before founding TechSearch International, she served on the corporate staff of Microelectronics and Computer Technology Corporation (MCC), the electronics industry’s first pre-competitive research consortium.
Senior Managing Director, Evercore
Tom Stokes is a Senior Managing Director of the firm’s corporate advisory business. Mr. Stokes is focused on advising clients across the technology sector.
Prior to joining Evercore, Mr. Stokes was a Managing Director in the Investment Banking Division at Goldman, Sachs & Co., where he served as global head of Electronics and Industrial Technology Investment Banking. With over 18 years of relevant experience and over 13 years at Goldman Sachs, Mr. Stokes has extensive experience advising companies across the technology industry. In particular, he has advised on a number of the most notable recent transactions across the semiconductor, electronics and industrial tech subsectors. Clients represented by Mr. Stokes include Aeroflex, AZ Electronic Materials, Belden, Brooks, CDW, Dover, Edwards, Entegris, Freescale, IBM, Lam Research, Lexmark, Macom, Molex, Keysight, Koch Industries, TE Connectivity, Samsung, Sensata, Solectron, Tokyo Electron, Universal Display, Viasystems and Vishay, among others.
Mr. Stokes received his BA, MA and MEng degrees (First Class) in Engineering from Cambridge University and received his MBA degree from Kellogg School of Management.
CEO and Executive Vice President, Unisoc Group
Steve Chu, CEO of Unisoc Group and Executive Vice President of Unigroup, has 22 years of experience in the telecommunication, semiconductor and investment industries. Before joining Unisoc,Steve took various senior executive positions, including Vice President of Strategy and Technology at Huawei, Chief Strategy Officer at Hisilicon, Head of Huawei Innovation Incubator, Director of Wireless Business at Hisilicon, Deputy General Manager at Datang Mobile, General Manager of Wireless Research Division at Huawei and etc. Steve also led the Microelectronics Division of CAS Zhangjiang Research Center in Shanghai.
Steve is widely respected in the mobile telecommunication and microelectronics industries, as the founder of several important technologies and the owner of a number of international patents.Steve led the invention of the first commercialized wireless base station in China, and the first prototype of software radio base station inthe world. He led the development of the first mobile phone chip solution (Holly Communication’s CDMA), the first TD-SCDMA mobile phone chip solution (Datang Mobile), and the first WCDMA mobile phone chip solution (Huawei Hisilicon) in China, as well as the first set of WCDMA base station chipset in the world.
In addition to his devotion in research activities, Steve is a promotor of technology commercialization. He drove the international commercialization of the Broadband SoftwareRadioTechnology, founded the Huawei Innovation Incubator, and developed greenfield projects in high-speed railway telecommunication, e health, digital home, new energy etc.By acquiring the British start-up NEUL, Steve promoted the NB-IOT technology standard and the industry in China.
Steve has also built one of the most experienced investment team in the semiconductor industry in China. He has a successful track-record of over 10 investment and acquisitions in China, Britain, Belgium, Israel, Singapore etc. Steve was also the founding member of the Advanced Semiconductor Technology Research Center– a high profile organization established bySMIC, Huawei and Qualcomm, whose signing ceremony was witnessed by President Xi of China and King Philippe of Belgium. Steve is a member in the investment committee of the Sino IC Industry Investment Fund.
Steve graduated with a master degree from Xi‘an Jiaotong University,
VP Corporate Supply Chain & Factory Integration, Infineon
Vice President & General Manager, Broadcom Limited
Martin Weigert is the Vice President & General Manager of the Industrial Fiber Products Division which manufactures fiber products targeting the industrial, automotive and emerging markets. Martin Weigert worked for Siemens/ Osram / Infineon / Avago for over 20 years and has held various development & marketing positions in the company’s fiber optic and LED product divisions.
Martin has many years of experience in leading positions for development and marketing of optoelectronic components for the automotive and fiber optic markets. He is currently in charge of the P&L for the Industrial Fiber Product Division at Avago Technologies.
Martin studied Micro System Technology and has a technical background in MEMS, Optoelectronics and Semiconductors. He is the managing director of the Avago Technologies Fiber GmbH in Germany, Avago Technologies Fiber Austria GmbH and a member of the supervisory board at the Munich based MIC AG, an early stage investor for high tech companies.
COO, Nantong Tongfu Microelectronics
Mr. Yc Lee was born in Penang, Malaysia. He has been living in Shanghai, China since 2002. He started with Intel in 1987, was given the opportunity to start-up the 1st Intel CPU assembly and test factory in Shanghai, China in 2002; followed by the 2nd CPU factory in Chengdu 2 years later.
He joined STATS ChipPAC, as the President and Managing Director for their Shanghai Plant from 2006 to 2014.
He was the Vice President, Special Assistant to Chairman in China Resources Microelectronics Limited in 2015. He was responsible for New Business Development, Company Globalization Strategies and Involved in potential merger and acquisition.
And now, Yc Lee is COO of Nantong TongFu Microelectronics Co., LTD.
Yc Lee has 32+ years of relevant experience and expertise covering Product Engineering, IC Packaging Assembly and Testing, Quality, Manufacturing Operation， Business Development, New Product Development and Introduction etc. He has lived and worked in Malaysia, U.S.A and China.
Vice President of Silicon Technology, Xilinx
Xin Wu is Vice President of Silicon Technology, XILINX INC. He received PhD and MSc from University of California Berkeley USA and Peking University, China respectively. Jointed Xilinx since 1993, he has worked from 0.6um till 7nm currently, more than 14 generations of technologies and products, from many foundries. His responsibilities include silicon, 3D-IC, advanced packaging, thermal mechanical solutions and many other technologies development in Xilinx.
Director of Engineering / AI Chief Scientist, Microelectronics
Dr. Ke Xu got the B.S. and M.S. degrees in Electrical Engineering Department from Fudan University, Shanghai, China, in 2000 and 2003, respectively, and the Ph.D. degree with Outstanding Award from the Department of Electronic Engineering, The Chinese University of Hong Kong in 2007. He was also the Post-doctoral Research Fellow in the Department of Electrical and Computer Engineering at the University of Toronto in 2009.
He served various senior roles as Staff/Algorithm Engineer, Chip Architect, Research Scientist, in different companies from startups to Fortune 500 such as IBM and Qualcomm, in China, Canada, and the USA. As key R &D member for Snapdragon 810/820/835 development in Qualcomm headquarter in San Diego, he was in charge of artificial intelligence/computer vision system, virtual/augmented reality, and image and video processing system design. He joined ZTE Microelectronics in 2015 as AI Chief Scientist and Director of Engineering, where he is in charge of AI, autonomous driving, AR/VR, and multimedia chip designs. He led an R&D group of more than 100 engineers with tens of technical experts. He developed several multimedia SoCs including smartphone, IPTV, IPC with advanced 28nm technology. He is also the Researcher in the State Key Laboratory of Mobile Network and Mobile Multimedia Technology. He founded the Chengdu R&D center and expanded from 0 to around 50 employees.
SVP & CTO, Besi
Studied Semiconductor Physics and High Vacuum in the Netherlands, started at ASM Europe in 1984 in Front Equipment (Diffusion, PECVD, Epi and Litho). Moved to MRC (Sputter and Etch). Later joined Balzers/Oerlikon responsible for display equipment division and materials division.
Since 2010 active for Besi. Became SVP for Die Attach group in 2014 and current position CTO for Besi.
Director & Principal Analyst, Packaging, Assembly, Substrates & Semiconductor Manufacturing, YOLE
Santosh Kumar is currently working as the Director & Principal Analyst, Packaging, Assembly, Substrates & Semiconductor Manufacturing. He is the author of several reports covering various packaging platforms, equipment, and materials. He received the bachelor and master’s degree in engineering from the Indian Institute of Technology (IIT), Roorkee and University of Seoul respectively. He has published more than 40 papers in peer-reviewed journals and has obtained 2 patents. He has presented and given talks at numerous conferences and technical symposiums related to advanced microelectronics packaging
CTO, Continental China
As CTO for Continental China;
Ms. Orlando began working for Nanotronics’ co-founders Matthew and John Putman at their previous company, Tech Pro, Inc. where she played a key role in the hardware development, sales, and customer service. Tech Pro was acquired by Roper Industries in 2008. Ms. Orlando went on to run a division of Duramax, leading projects for major industrial entities, defense contractors, and branches of the military. Ms. Orlando joined Nanotronics as employee number three, where she is currently Chief Product Officer. Ms. Orlando has published several papers in both domestic and international journals, which she has presented at material science conferences and symposia.
SVP & Deputy GM Production and Technology Unit, Renesas Electronics Corporation
Tomomitsu Maoka is Senior Vice President and Deputy General Manager, Production and Technology Unit at Renesas Electronics Corporation, leading its global transformation of manufacturing structure. In addition, he is Chairman for Renesas Electronics China, engaged in activities related with Public Affairs and Industry Relations.
From March 2017 to Mach 2019, he was General Manager of China Business Unit at Renesas Electronics, led China-focused activities to capture growth and innovation opportunities through collaboration with ecosystem partners, to expand manufacturing partnership with China local foundries and assembly manufacturers, to strengthen relationship with government and industry community and to reinforce synergies among various functions of Renesas oriented for China region.
Maoka joined Renesas in 2013 as Vice President of Corporate Planning and led the turnaround of the company after capital injection by Japanese sovereign private equity fund, INCJ. In 2016, He was in charge of General Purpose Analog & Power business of Renesas and led it revenue turnaround until its consolidation with Intersil business which was acquired in 2017 February.
Prior to joining Renesas, Maoka led Post Merger Integration at Lenovo which acquired NECs personal computer business through Joint Venture structure. Prior to Lenovo, Maoka oversaw industrial business in Japan and of strategy development and alliance management in Japan at Infineon Technologies. Prior to Infineon, Maoka worked for A.T. Kearney as management consultant, where he served Japanese major clients in telecommunication, automotive, etc.
VP, Advanced Packaging Technology and Service, TSMC
Dr. Marvin Liao / 廖德堆博士
Vice President / 副總經理
APTS / 先進封裝技術暨服務
tsmc / 台灣積體電路製造股份有限公司
Adv. Package & Technology Integration, Amkor Technology
Curtis joined Amkor in 1999 and has held leadership roles in developing Amkor’s Fine Pitch Copper Pillar, Through Mold Via and MEMS packaging technologies. He is currently responsible for the development and commercialization of Amkor’s Advanced Wafer Level Fan-Out package technologies, including High-Density Fan-Out and SWIFT® technology. Curtis is Past General Chair of the International Wafer Level Packaging Conference 2016-2018 and the 2019 General Chair for the IMAPS Symposium on Microelectronics. He has authored numerous technical articles and papers and co-authored a chapter in the recently released book, “Advances in Embedded and Fan‐Out Wafer‐Level Packaging Technologies”. Curtis has been issued 21 US patents and holds a degree in mechanical engineering from Colorado State University and an MBA from the University of Phoenix.
Herbert Oetzlinger , graduated HTL Braunau 1987 in high power electronics/ electrotechnics,
SVP Technology & Operations Semiconductor BU, Nepes Corporation
He has been in the semiconductor area for 21 years with specialty of technology & business development in the advanced packaging area such as Fan Out WLP, Wafer level CSP, Flip chip bumping, SiP (System In Packaging) as well as Panel Level Packaging
He has started his work in LG / Hynix for reliability, material & process development of packaging in late of 1990s after he got Ph.D degree of material science engineering in Korea.
After that, he joined nepes Corporation in 2001 as engineering director but also as set up member of 1st bumping (6 & 8”) OSAT in Korea. He has also initiated 12” wafer level bumping project in Korea transferring the technology to Singapore working with EDB, Chartered (now Global Foundry) and also UTAC to set up the joint venture as 1st 12” bumping company in Singapore. During his staying in Singapore, he has worked with international customers in US, European Fabless, IDM companies and Taiwan foundries.
He has also led the technical marketing team in USA with his expertise and strength of technology, communication skill and engagement experience with customers. His main strengths are in the leadership in both of R & D and the broad experience in the production line operation as well as business development with his technology background.
In Singapore and Korea, he has involved and led multiple government funded mega project from R & D programs to its commercialization.
Currently he is responsible for Technology & Operations for WLP, Bumping & Test as well as Fan out WLP, Panel Level Package, and SiP business at nepes Corporation Korea as senior vice president taking care of profit & loss in Semiconductor business.
Technology basis major achievement
Business basis major achievement
Vice President R&D, JCET
Mr. Lin holds B.S. degree in Metal Materials & Heat Treatment from Huazhong University of Science and Technology with honor of outstanding graduate, M.S. degree in Composite Materials from Shanghai Jiaotong University, and M.S. degree in Materials Science from University of Rochester, NY, United States. He has over 20 years R&D experience in materials and semiconductor packaging development, especially in wafer level package and advanced packaging. He holds over 100 US patents in the field of semiconductor packaging.
SVP & GM of China Business Unit, Western Digital
Steven Craig is the Senior Vice President and General Manager for China Go-to-Market. He is leading our effort in creating a new China Go-to- Market operating model that will support, strengthening and expanding Western Digital’s ability to address the unique needs of China’s large and growing market. He will be based in Shanghai, China.
Steven has a rich experience and demonstrated leadership in customer support. He was most recently senior vice president of Quality for Western Digital Corporation, who oversaw the quality assurance and customer technical support functions worldwide for all of its brands. Prior to that he was senior vice president of Quality at HGST, and the senior vice president of customer experience at Dot Hill Corporation.
Steven previously spent 11 years at Maxtor Corporation, where he held multiple senior management positions, including vice president of worldwide customer engineering. Prior to joining Maxtor, Steven worked in various engineering positions at Conner Peripherals in the UK and in Houston. Steven earned his Bachelor’s Degree from Fife College of Technology, Scotland, UK.
Senior Principal Analyst, Automotive Semiconductor, IHS Markit
Mr. Phil Amsrud, a senior principal analyst at IHS Markit, covering the automotive semiconductor market in general with a special focus on advanced driver-assistance systems (ADAS) and autonomous driving.
Phil Amsrud is a senior principal analyst for the IHS Markit’s automotive semiconductor research area with a special focus on advanced driver-assistance systems (ADAS) and autonomous driving technologies.
Phil began his career in automotive electronics as a design engineer at GM on their ABS systems. From there he joined Motorola Semiconductor Products Sector supporting Delphi Electronics then became part of Freescale Semiconductor that was spun off from Motorola. At Freescale he managed the field sales and applications engineers supporting Continental Automotive. After obtaining a masters in business, Phil joined ON Semiconductor and was responsible for field sales and applications team in the Americas region supporting Continental Automotive. Phil also served as new business development manager for the Americas at BAE Systems/Fairchild Imaging prior to joining IHS Markit.
Phil holds both a Bachelor of Science in Electrical Engineering and Master of Science in Business degrees from the University of Wisconsin-Madison, US.
While great efforts were made to ensure accurate and up-to-date information on this website, China International Semiconductor Executive Summit makes no representations or warranties whatsoever, express or implied, as to the content of this website and the products and services described therein, including, without limitation, with respect to accuracy, completeness, non-infringement, merchantability, fitness for a particular purpose, or availability, and China International Semiconductor Executive Summit disclaims any liability for losses or damages of any kind, including losses or damages resulting from the transmission or downloading of computer viruses.
The content of this website may be changed at any time without notice. Links to other websites are provided for the user’s convenience. China International Semiconductor Executive Summit does not express an opinion on the content or the properties of such linked websites and disclaims any liability in connection therewith. The information contained on this website does not constitute an offer for products or services. Investors must not rely on information provided on this website for investment decisions.
Terms & Conditions
Mustafa Pinarbasi is the CTO and Sr. Vice President of Magnetics Technology at Spin Memory (Previously Spin Transfer Technologies). Before joining Spin Memory in 2013, Dr. Pinarbasi was a CTO and SVP of Technology Development at SoloPower, Advanced Technology Department Manager at Hitachi GST and Distinguished Engineer at IBM. His accomplishments at IBM include the development of the giant magneto-resistance sensor used in the first GMR-based hard disk drives (HDD) and pioneering the adoption of ion beam sputtering technology into the read sensor production. He led the development of tunneling magneto-resistance (TMR) read head processing at Hitachi GST and the development of flexible and light weight solar panels at SoloPower. Dr. Pinarbasi holds a Ph.D. from the University of Illinois at Urbana-Champaign. He is an inventor with over 200 U.S. patents, has authored or co-authored over 30 scientific publications and has received numerous industry awards.
Mr. Ning Chen used to work in the mobile communication industry in Japan for long years. After joined Panasonic in 2003, he has been engaged in the development of advanced sensor solutions for smart systems. He is now the Director of China Technology Center of Industrial Solutions Company.
Ron, who joined CNW in early 2013 after over a decade at DHL, sees himself as customer-centric. He is available day and night to listen and help customers realize that CNW is their most reliable special logistics partner. Ron believes in open communications and making it easy for them to approach CNW with urgent and emergency shipping challenges, no matter how complicated.</span>
And as a big basketball fan and food connoisseur, Ron welcomes the opportunity to enjoy a good meal after a great game.
Hermann Waltl is currently the executive sales and customer support director for EV Group (EVG). In this role, he is responsible for overseeing EVG’s worldwide sales operations across all of the company’s product lines and key markets including Asia Pacific, Europe and North America. Waltl joined EV Group in 2002 as a sales operations manager where he was responsible for all aspects of worldwide contract management and sales administration for three years.
Prior to EVG, he held several management positions at Amdahl Deutschland GmbH (Amdahl Germany Ltd.), including most recently as director of professional services for Central Europe, and country manager for Switzerland and Austria. In this role, he oversaw an organization of 120 employees and provided consulting services to the IT industry. Before that, Waltl served as both a project manager and sales manager at Nixdorf Computer GmbH/Siemens Nixdorf Information Systems in Salzburg, Austria.
Waltl received a master of business administration degree, with an emphasis on business economics and strategic corporate management, from the University of Innsbruck, Austria.
Julio Coppo is currently serving the role of Vice President of Sales and Strategic Business Development for Nanotronics, a technology company that builds robotic, artificially intelligent industrial grade microscopes, including nSpec® and nSpec® 3D. nSpec®’s highly customizable software and hardware, enables these products to serve the semiconductor, material sciences, rubber, pharmaceutical and biotechnology industries. Julio joined Nanotronics in the Fall of 2016 and he oversees the global sales and customer outreach team.
Julio spends his personal time with his children and volunteering in youth enrichment programs such as Assistant Scout Master for Boy Scouts of America, and coaching youth ice hockey.
Previously Julio served as Regional Sales Manager at SUSS MicroTec, Strategic Account Manager for DCG Systems, and Sales and Applications Manager at Schlumberger Automated Test Equipment. Prior to Julio’s entry into the semiconductor industry, Julio served in the U.S. Navy as a Naval Flight Officer, patrolling the skies in the P-3, Orion, Submarine Hunter aircraft.
Mario Morales is the program vice president of IDC’s enabling technologies, storage, and semiconductor research. He is responsible for in-depth analysis, evaluation of emerging markets and trends, forecasting, and research of major semiconductor industry segments such as embedded and intelligent systems, wireless, personal computing, networking and cloud infrastructure, automotive electronics, and consumer.
Mr. Morales is an accomplished program vice president, manager, and industry expert with over 25 years of experience in building a multinational top-tier consulting, sales, and research team and driving a set of established businesses. Solid experience in managing strategic partnerships and advisory services with IDC’s largest multinational clients. Strong analytical, strategic planning skills, and managing complex projects involving strong collaboration across geographies, functional groups, and business units. Proven leadership skills and instrumental at establishing research and business KPIs.
Mr. Morales is a trusted advisor to leading high tech company executives, financial investors, and bankers on market landscape and direction, product and technology positioning, competitive benchmarking, M&A, HW, and SW technology, and brand health and sustainability. Established relationships with technology suppliers including Intel, Samsung, TSMC, Qualcomm, Huawei, HP, AMD, NVIDIA, Microsoft, Facebook, TI, Micron, IBM, GE software, SoftBank, ARM, NXP, and others.
Mr. Morales is the leading advisor and expert analyst for IDC’s largest Wall Street clients including investment banking, VC’s, and mutual and hedge funds across every major financial region.
Over his career, Mr. Morales has authored and co-authored over 240 reports and studies in the area of semiconductors, mobile, PC, wireless, embedded, IoT, and IT marketplace. His team is responsible for some of the most interesting and evolving tech in our industry including coverage of microprocessors, accelerated computing, storage and memory,sensors and connectivity. His team has been responsible for initiating coverage of emerging technologies for IDC, and driving new research business practices, and creating leading industry market models in DRAM, NAND, Embedded processors and controllers, accelerated computing architectures, cellular baseband modems, WLAN, WiMAX, cellular broadband, digital consumer, foundry, EMS, intelligent systems, and overall semiconductors.
His career includes past postions with NEC Electronics and Dataquest.