Call: +86 130 5205 9328 |

2019 Programme

The programme for the China International Semiconductor Executive Summit has gone through thorough revision to ensure it meets the needs of the international semiconductor industry through analysis of our high level advisory board.

If you have any questions or contributions towards the programme, please contact us

Theme: Vision 2025 – The Drift of Semiconductor Eco-System

Day 1 – Advanced Packaging / Fabless / 5G / Research Institutes

Theme:

The collaboration of OSATS and IC Design Companies

Equipment Manufacturer in OSAT world

What’s happening with 5G?

Industry Update from Research Institutes

         

    Day 2 – Front End Manufacturing / Advanced Manufacturing / Market Research / Automotive Semiconductor /AI

Theme:

Front End Manufacturing Update

Memory Manufacturing

Automotive Semiconductor Stream

AI Semiconductor

Market Research & M&A

Day 1
05 Sep 2019
Day 2
06 Sep 2019

Registration

08:15 - 18:50

Advanced Packaging / Fabless / 5G / Research Institutes

Panel Discussion 1

10:45 – 11:45

Business Meetings / Networking Session / Coffee and Tea Break

Xin Wu, VP of Silicon Technology – Xilinx

Panel Discussion 2

14:00 – 15:00

Lunch

Panel Discussion 3

16:50 – 17:50

Business Meetings / Networking Session / Coffee and Tea Breaks

Julie Orlando, Nanotronics

IMEC – TBC

EVG

Closing Remark

19:05 – 21:30

Cocktail and Dinner

21:30 - 00:00

Entertainment

Registration

08:30 - 19:05

Front End Manufacturing / Advanced Manufacturing / Market Research / Automotive Semiconductor / AI

Exyte – TBC

TowerJazz – TBC

Panel Discussion 5

11:10 – 12:10

Business Meetings / Networking Session / Coffee and Tea Breaks

SPIN Memory – CTO

SK Hynix – TBC

CXMT – TBC

Panel Discussion 6

13:45 – 14:45

Lunch

AUDI/ FORD TBC

Panel Discussion 7

16:20– 17:20

Business Meetings / Networking Session / Coffee and Tea Breaks

Closing Remark

19:05 - 21:00

Dinner

21:00 - 00:00

Entertainment