Keynote Address| Babak Sabi, Corp VP & Director of Assembly & Test Technology Development – Intel Topic: Advanced Packaging, Heterogeneous Integration, and Big Data
The world around us is becoming more and more dependent on data. As Clive Humby, UK Mathematician, put it “data is the new oil; if unrefined, it cannot really be used”. Processing big data efficiently is heavily dependent on advances in system compute and comms. This presentation will talk about the requirements for advancing system performance including high bandwidth and low power data pipes; and the methods by which ultra-high performance for next generation devices can be achieved through heterogeneous integration on advanced packages. A multitude of multi-chip packaging including 2D, 2.5D, and 3D will be reviewed including the challenges associated with meeting the needs of next generation HPC devices. This will cover the innovations needed in materials, equipment, process and design as related to package substrate, assembly and test in advancing the next generation of heterogeneous packaging technologies.