Curtis Zwenger, VP Adv. Packaging & Technology Integration – Amkor | Topic: Advanced Packaging: The Rise of Heterogeneous Integration
With the improbable sunsetting of Moore’s Law, the timely rise in technological innovation within the semiconductor packaging technology sector allows continued growth of the industry without missing a step. Moore’s law historically addressed the complexity of simultaneously reducing costs and scaling. More recently, Moore’s Law is more about economics than anything else. The limitations found in economically scaling silicon at the most advanced nodes has paved the way for newer packaging technologies to provide improvements and continue to address the need for improved power, electrical performance and cost at the most advanced nodes. The continued goal of improving performance per watt is now being addressed at the packaging level through Heterogeneous Integration (HI). Heterogeneous Integration at the packaging level allows the joining of components of different functionalities and technological complexity together within the same system or module. In the current period of high innovation in packaging technology platforms, many new packaging technologies are being pushed forward to address the need for extreme integration of disparate chip technologies across multiple product disciplines. This presentation will discuss the variety and complexity of packaging technologies being introduced using Heterogeneous Integration.