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Daquan Yu, CEO – Xiamen Sky Semiconductor | Topic: Advanced 3D Wafer Level Packaging for 5G System Integration

05 Sep 2019
14:00 – 14:20

Daquan Yu, CEO – Xiamen Sky Semiconductor | Topic: Advanced 3D Wafer Level Packaging for 5G System Integration

The fast growth of Intelligent Mobile Terminal, IoT, 5G, AI, Deep learning brings more critical requirements for advanced packaging. Wafer Level Packaging is very important for 5G device integration. Wafer level Fan-in can be used for SAW/BAW filters and IPD, RF modules. Wafer Level Fan-out can be used for RF modules and mmWave chips.  Recently, glass wafer level packaging using through glass via (TGV) technology and embedded glass fan-out (GFO) technology become more and more mature. They can be used for 3D integration for IPD, mmWave, RF module. The advantages of glass wafer packaging include small form factor, low cost, simple process, and excellent electrical performance. There are still a lot of innovation works for the development of Wafer Level System Integration Technology for various 5G applications.