Jan Vardaman, President – TechSearch | Topic: What’s Driving Heterogeneous Integration?
The semiconductor industry and the business of packaging and assembly are undergoing a major change. Applications impacted by the changes range from AI accelerators to automotive electronics. Heterogeneous integration is an economic solution that addresses the end of silicon scaling. These options include silicon interposers, fan-out wafer level packages, and system-in-package. Some high-solutions in which some die functions are fabricated on the latest nodes, combined with other die fabricated on older less expensive nodes and linked together in the package. Combinations of memory and logic in the same package are increasingly common. This presentation discusses many heterogeneous packaging options and the reasons for use in each application.