06 Sep 2019
17:30 – 17:50
M. Juergen Wolf, VP Advanced Packaging – Fraunhofer IZM ASSID | Topic: Heterogeneous Integration – Requirements and Enabling Technologies
Main relevance of heterogeneous system integration
is to address the needs of time to market and cost targets for future products in the application areas Internet of Things (IoT),
Cyber Physical Systems (CPS), Industry 4.0, Ambient Assisted Living (AAL) Artificial Intelligence (AI), autonomous driving and
others. Today‘s system integration technologies are driven by System in packages (SiPs) approaches.
New technologies are emerging which specifically meet the requirements regarding performance enhancement and
miniaturization, high speed wireless data transmission, power delivery & management and multi-device integration for products in a connected world. In this context, System in packages (SiPs)
technologies are driving today‘s packaging and heterogeneous system integration technologies on board/substrate and wafer level. Heterogeneous Integration refers to the integration of separately manufactured components into a higher packaging
level. SiPs provide enhanced functionality and improved operating characteristics. All technologies have to provide cost efficient packaging & system integration solution that meet application specific requirements with a short time to market.
Beside the development of new processes and the implementation of new materials heterogeneous integration
requires an overall approach which includes design and reliability
tasks. The talk will focus on key processes for the realization of