Marvin Liao, VP Backend Semiconductor Operations – TSMC | Topic: Advanced Packaging Solution for High Performance Computing
We established the advanced packaging solutions for various HPC applications. The CoWoS is for high-end, performance demanding application with strong market momentum. The InFO_oS, is for Networking/Switching and InFO_MS for AI Inferencing application. The InFO package used for mobile/consumer products is in high volume and high yield manufacturing. We also successfully demonstrated 3D IC stacking using our SoIC (System on Integrated Chips) and wafer-on-wafer (WoW) process on N7 silicon. The SoIC allows integration of different size dice, KGD stacking, and multiple dice in a stacking layer. The WoW can support much finer (down o 2um) inter-chip connection. The Integration of frontend 3D (SoIC and WoW) and backend 3D (InFO, CoWoS, and MCM) starts a new era of 3D heterogeneous system integration, to provide industry needs in Mobile, IoT, Automotive and HPC application. A full automation of “front-end like” manufacturing system was established for 3D advanced packaging to serve customers product TTM and TTV.