Dr David Lishan, Principal Scientist & Director Technical Marketing – Plasma-Therm | Topic: Low Temperature, Low Damage Plasma Technologies for Advanced Packaging Applications
Trends in advanced packaging for precision, performance, reliability, size, shape, costs and package integration are some of the requirements driving manufacturers to employ front-end technologies, like dry etching and deposition. However, integrating plasma-based solutions can be challenging as substrates and materials are often sensitive to high temperatures and plasma damage. Plasma solutions and chemistries should be compatible with exposed materials on a finished wafer such as bump-metals, dielectrics, passivation, and other organic materials to reduce damage risks.
We will discuss relatively low temperature (<150C), low damage dry etch and deposition solutions in a range of applications that include PR/polymer striping, surface activation/modification, TSV reveal/thinning, conformal liners, and plasma dicing.