Mr Juergen Wolf, VP Advanced Packaging – Fraunhofer | Topic: Heterogenous Wafer Level System Integration
Heterogeneous system integration is of main relevance to address the needs of time to market and cost targets for future products in the application areas e. g. Internet of Things (IoT), Industry 4.0, Ambient Assisted Living (AAL). System in packages (SiPs) are driving today‘s system integration technologies. New technologies are emerging which specifically meet the requirements regarding e.g. miniaturization, high speed wireless data transmission, power delivery & management or multi-device integration of the new product generations in a wireless connected world. In this context, individual and different wafer level packaging and 3D system integration approaches are adapted to the specific application scenarios. The presentation will focus on same major approaches.