Olaf Herzog, VP Supply Chain – Infineon | Topic: Infineon’s implementation of Industry 4.0 across the Global Manufacturing base
The semiconductor industry has gone through multiple phases of digitalizing information flow end-to-end and increasing the automation level of factories. The level of capabilities have increased from generation to generation – high automated 300mm factories today can be built cost-effectively with a multitude of commercial offerings from equipment suppliers, automation suppliers and manufacturing software suppliers with detailed standards ensuring the interoperability. On the other hand, several types of technologies will remain on older production lines and equipment, e.g. 200mm or 150mm wafer fab manufacturing, where equipment and factory do not have the same level of standardization and automation capabilities. What can we do as an industry to improve overall and provide more of the benefits of digitalization across the board? How do we approach this end-to-end, from the raw wafer to the assembled and tested parts and where are practical limits? This presentation will summarize these aspects and propose a vision for the year 2025 based on continuous collaboration within the industry to drive standards.