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Panel Discussion Moderated by – Merck

05 Sep 2019
15:20 – 15:50

Panel Discussion Moderated by – Merck

TSMC – Marvin Liao, VP Advanced Packaging Technologies and Services

Amkor – Curtis Zwenger, VP Adv. Packaging & Technology Integration

TFME – YC Lee, COO

Intel – Babak Sabi, Corp VP & Director of Assembly & Test Technology