05 Sep 2019
16:50 – 17:10
Ruurd Boomsma, CTO – Besi | Topic: Advanced Packaging Becoming Key Enabler For Next Generation Devices
Advanced packaging is becoming a key enabler for next generation devices. Requirements for high accuracy and speed for die placement and molding will be discussed, as well as the need for new levels of cleanliness for back end equipment. A short review of large area panel will be given as well as some key developments for automotive and power applications.