Yu-Po Wang, Senior Director – SPIL | Topic: Advanced Packaging Application and Challenges for 5G Era
The expectation for 5G is reaching climax in 2019. It should not only affect communication application in handphone, also IoT in factory for smart manufacturing. Furthermore, it could also be an essential part of autonomous driving. 5G also brings some challenge to electric package with some specific requirements.
The presentation is going to talk about Package Solutions for 5G Networking and IoT. Those solutions would include advanced packages of SiP, FO-WLP, and 2.5D.
The content will be include:
- 5G Packaging Solution
- Millimeter Wave at SiP Module
- IOT and High Performance Computing at FO-MCM, 2.5D