Steve Hah, EVP Head of Substrate Solutions BU – Samsung | Topic: The role of advanced packaging and substrate in semiconductor innovation
Along with the innovation of semiconductor, packaging and substrate technologies continue many changes.
Depending on the complexity, the development of packaging technologies can be divided into 3 stages:
The earliest packaging was leadframe, and this evolved into flip-chip package which allows higher I/O density. Recently, as the frontend innovation is facing the limits of Moore’s law, the needs of the additional innovation on the packaging is increasing and the third stage of packaging such as fan-out panel/wafer level package is introduced.
In addition, the adoption of AI, 5G and autonomous vehicles are generating the explosion of disruptive packaging solutions such as fan-out package and the fusion of existing substrate processes. Those solutions improve power integrity, lower impedance for high performance computing and allow heterogeneous integration.
In this presentation, the technology development in package substrate and the next generation substrate will be discussed.
Furthermore, the new disruptive technologies such as embedded and hybrid type of FCBGA, interposer substrate which can break through the limits of conventional technologies will be introduced.