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Yaojian Lin, Group VP & GM of Technology R&D Center (China)-JCET | Topic: Semiconductor Package Advance and it’s Ecosystem Development

05 Sep 2019
12:30 – 12:50

Yaojian Lin, Group VP & GM of Technology R&D Center (China)-JCET | Topic: Semiconductor Package Advance and it’s Ecosystem Development

With limit of Moore’s Law being approached in Si node, semiconductor package has been playing more and more important role in 5G communication, HPC/AI, and Automotive. Semiconductor packaging technology achieved significant progress in recent years. In this presentation, semiconductor advances in WLP / PLP, SiP and 3D integration are discussed. Together, its impact on semiconductor ecosystem is discussed.