Curtis joined Amkor in 1999 and has held leadership roles in developing Amkor’s Fine Pitch Copper Pillar, Through Mold Via and MEMS packaging technologies. He is currently responsible for the development and commercialization of Amkor’s Advanced Wafer Level Fan-Out package technologies, including High-Density Fan-Out and SWIFT® technology. Curtis is Past General Chair of the International Wafer Level Packaging Conference 2016-2018 and the 2019 General Chair for the IMAPS Symposium on Microelectronics. He has authored numerous technical articles and papers and co-authored a chapter in the recently released book, “Advances in Embedded and Fan‐Out Wafer‐Level Packaging Technologies”. Curtis has been issued 21 US patents and holds a degree in mechanical engineering from Colorado State University and an MBA from the University of Phoenix.