Babak Sabi is the Corporate Vice President and General Manager of Assembly and Test Technology Development. Since 2009, he has been responsible for the company’s packaging assembly process, packaging materials, enabling assembly and test technology development. Sabi join Intel in 1984.
Prior to leading ATTD, Sabi led the Corporate Quality Network within Intel’s Technology Manufacturing Group from 2002 to 2009. He led a company-wide network of quality and reliability organizations responsible for product reliability customer satisfaction and quality business practices.
Previously, Sabi managed technology development quality and reliability, and was responsible for silicon technology certification, assembly, test and board processes.
Sabi received his Ph.D.in solid state electronics from Ohio State University in 1984. He has written 10 papers on reliability physics and has received 5 Intel Achievement Awards. He currently hold 2 patents.