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Marvin Liao, TSMC

VP, Advanced Packaging Technology and Service

Marvin Liao, TSMC

VP, Advanced Packaging Technology and Service

Biography

Dr. Marvin Liao / 廖德堆博士

Vice President / 副總經理

APTS / 先進封裝技術暨服務

tsmc / 台灣積體電路製造股份有限公司

Education

  • Ph.D. Materials Science, University of Texas at Arlington, USA, 1989
  • Bachelor Materials Science, Tsing Hua University, Taiwan, 1979

Experience 

  • tsmc Advanced Packaging Technology and Service, 2011 – now
  • tsmc Special Project, 2009 – 2010
  • tsmc Fab 6 Director, 2003 – 2009
  • Chartered Semiconductor, Singapore, 1997 – 2002
  • Applied Materials, USA, 1994 – 1997
  • SGS Thomson Microelectronics (STM), USA, 1990 – 1994

All sessions by Marvin Liao, TSMC