Wang Yu-Po received Ph.D. in Mechanical Engineering from State University of New York at Binghamton, U.S.A
In 1997, he started career at Gintic Institute of Manufacturing Technology in Singapore. He has jointed SPIL since 1998 and led the R&D advanced packaging design team for leadframe, substrate and wafer form packages development.
Dr. Wang has strong knowledge and experience in packaging characterization including thermal/ electrical simulation, advanced material(co-development), design and advanced packaging development. He has 83 patents in US.
- 1997-1998 Gintic Institute of Manufacturing Technology, Singapore
- 1998-Present SPIL, Taiwan