Herbert Oetzlinger , graduated HTL Braunau 1987 in high power electronics/ electrotechnics,
Herbert worked in the Semiconductor industry for 25+ years, focused on wet processing .
Special focus on advanced packaging in electroplating and wet etching/cleaning of wafers and substrates. For many years he was VP of Sales with Semitool Inc, where he excelled with his in depth knowledge of process and hardware. During this time, Herbert worked with many worldwide leading companies on Fan out, EWLB and other new developments in wafer level advanced packaging.
In 2012, he founded Semsysco GmbH and is also heading the company as CEO.
Semsysco is a world leader in high speed electrochemical deposition with a pedigree and expertise in all around wet processing for wafer and panel level.