M. Juergen Wolf received a M.S. degree in Electrical Engineering from the Technical University Chemnitz. After gaining fundamental experience in the industry for several years, he joined the faculty Microperipheric Technologies at the Technical University Berlin. Here, he was mainly involved in the development of wafer level packaging processes, the development of flip chip multi-chip modules, RF modules and high density pixel detector modules. In 1994 M. Juergen Wolf changed to Fraunhofer Institute for Reliability and Microintegration IZM Berlin and worked as a group & project manager in the department HDI&WLP in the field of wafer level packaging and system in package (SiP). He was especially responsible for the development, coordination and implementation of new technologies for wafer level packaging and system integration. From 2000 until 2010 he additionally took over the position of personal assistant for the director of Fraunhofer IZM – Prof. Dr.-Ing. Dr.-Ing. E.h. Herbert Reichl. Starting in 2009, he was coordinating and planning and realization of the new center – All Silicon System Integration Dresden – ASSID of Fraunhofer IZM. Under his leadership a full industrial compatible process line for Wafer level Packaging and 3D integration was established. Since 2011, he is head of the department “Wafer Level System Integration” and also continued managing the center ASSID featuring a 200/300 mm 3D wafer level integration line. M.J. Wolf is actively involved in a number of research projects on national, European and international level. M. Juergen Wolf is a member of IEEE and SMTA and among others, a longstanding member and European representative in different technical international packaging groups e.g. formally TWG of Assembly & Packaging of the International Roadmap of Semiconductors (ITRS) and now the Heterogeneous Integration Roadmap (HIR) and the Jisso International Council (JIC) where he is actively contributing to the strategy and packaging roadmap development. Since 2016 Wolf is a member of the advisory board of 3D Incites (https://www.3dincites.com/about-us/advisory-board/). Wolf is one of the initiators and co-chair of the Fraunhofer Cluster 3D Integration which was established in 2013 and comprises 5 Fraunhofer institutes. He has also initiated the annual 3D European Summit Conference where he is a member of the steering committee. He has authored and co-authored numerous scientific papers presentations and reports in the field of microelectronic packaging and holds a number of patents.