Mr. Yc Lee was born in Penang, Malaysia. He has been living in Shanghai, China since 2002. He started with Intel in 1987, was given the opportunity to start-up the 1st Intel CPU assembly and test factory in Shanghai, China in 2002; followed by the 2nd CPU factory in Chengdu 2 years later.
He joined STATS ChipPAC, as the President and Managing Director for their Shanghai Plant from 2006 to 2014.
He was the Vice President, Special Assistant to Chairman in China Resources Microelectronics Limited in 2015. He was responsible for New Business Development, Company Globalization Strategies and Involved in potential merger and acquisition.
And now, Yc Lee is COO of Nantong TongFu Microelectronics Co., LTD.
Yc Lee has 32+ years of relevant experience and expertise covering Product Engineering, IC Packaging Assembly and Testing, Quality, Manufacturing Operation， Business Development, New Product Development and Introduction etc. He has lived and worked in Malaysia, U.S.A and China.