Mr. Lin holds B.S. degree in Metal Materials & Heat Treatment from Huazhong University of Science and Technology with honor of outstanding graduate, M.S. degree in Composite Materials from Shanghai Jiaotong University, and M.S. degree in Materials Science from University of Rochester, NY, United States. He has over 20 years R&D experience in materials and semiconductor packaging development, especially in wafer level package and advanced packaging. He holds over 100 US patents in the field of semiconductor packaging.