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2019 Speakers

Should you wish to be a speaker please contact us.

Tom Stokes, Evercore

Senior Managing Director

Jennifer Zhao, ams AG

EVP and GM for Advanced Optical Sensors Division

Martin Weigert, Broadcom Limited

Vice President & General Manager

Steve Hah, Samsung

EVP Head of Substrate Solution Business Unit

Santosh Kumar, Yole

Director & Principal Analyst, Packaging, Assembly, Substrates & Semiconductor Manufacturing

Olaf Herzog, Infineon

VP Corporate Supply Chain & Factory Integration Infineon

Steven Craig, Western Digital

SVP & GM of China Business Unit

Jong Heon Kim – NEPES Corporation

SVP Technology & Operations Semiconductor BU

Ke Xu, ZTE Microelectronics

Director of Engineering / AI Chief Scientist

Daping Yao, NCAP

Technical Director

Farhat Jahangir, Quantenna

SVP, Manufacturing & Quality

Tomomitsu Maoka, Renesas Electronics Corporation

SVP & Deputy GM Production and Technology Unit

Curtis Zwenger, Amkor Technology

VP 
Adv. Package & Technology Integration

Phil Amsrud – IHS Markit

Senior Principal Analyst, Automotive Semiconductor

Babak Sabi, Intel Corporation

Corporate VP, GM Assembly & Test Technology Development

Marvin Liao, TSMC

VP, Advanced Packaging Technology and Service

Yu-Po Wang – SPIL

Senior Director

2018 Speakers

Should you wish to be a speaker please contact us.

Dr Babak Sabi, Intel Corporation

Corporate VP, GM Assembly & Test Technology Development

Mr Gopi Sirineni, Qualcomm

VP Product Management

Mr Hubert Changchien, ASE

Director Customer Engineering Integration, Central Engineering

MR DAVID GREENLAW, NVIDIA

VP Product Engineering

Mr Claudio Piemonte, Broadcom Inc.

Head of Radiation Sensor R&D

Mr Yiran Liao, Alibaba Cloud

Technical Expert IoT BU

Mr Cao Hong, Infineon

IT Head for China

Mr Jaroslav Klima, Tescan Orsay Holding

Chairman of the Board and CEO

Dr David Lishan, Plasma-Therm LLC

Principal Scientist & Director Technical Marketing

Dr Marvin Liao, TSMC

Senior Director Backend Operations

Mr Farhat Jahangir, Quantenna

SVP, Manufacturing & Quality

SUNIL BANWARI

Consultant specializing in Industry 4.0 and semiconductor M&A

Mr SANTOSH KUMAR, Yole Development

Director & Principal Analyst

Mr Allen Chang, Macquarie Group

Head of Greater China Technology & Telecom Research & Managing Director

2017 Speakers

Dr Jun Zeng, MaxPower Semiconductor

Co-founder, CTO and Executive VP

Dr Manfred Horstmann, GLOBALFOUNDRIES

VP Technology & Integration

Mr Tom Stokes, Evercore

Senior Managing Director

Mr Mostafa Aghazadeh, Intel Corp.

VP, Tech Manufacturing Group

Mr Zhiyong Ma, Intel

VP Technology and Manufacturing

Mr David Chang, HTC

Director of Strategic Partnerships

Dr Vivek Dutta, Merck

Principal Technologist Semiconductor Packaging Solutions

Mr Farhat Jahangir, Quantenna

SVP, Manufacturing & Quality

Mr Sunil Banwari, ON Semiconductor

President/GM & Country Manager

Mr CY Chen, IDT

VP Global Manufacturing

Santosh Kumar, Yole Development

Senior Technology & Market Research Analyst

Mr Olaf Herzog, Infineon

VP Corporate Supply Chain & Factory Integration

Dr Sailesh Chittipeddi, IDT

CTO and Senior VP of Operations